NPGS  : Bonding Pads


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This image shows the leads and bonding pads for the split gate structure shown in the previous image. This entire device was written on an SEM with NPGS. The entire pattern is ~3 mm across. Twelve areas can be seen where alignment was performed. There were three sets of 4 alignment windows that were used to align writing done at different magnifications. The work was done at the University of Sherbrooke in Canada.